By Deborah D. L. Chung
Fabrics are the basis of know-how. As such, so much universities supply engineering undergraduates with the basic suggestions of fabrics technology, together with crystal buildings, imperfections, section diagrams, fabrics processing, and fabrics houses. Few, besides the fact that, supply the sensible, applications-oriented historical past that their scholars have to reach industry.
Applied fabrics technology: functions of Engineering fabrics in Structural, Electronics, Thermal, and different Industries fills that hole. From a cross-disciplinary standpoint that displays either the multifunctionality of many fabrics and the huge scope commercial wishes, the writer examines the sensible purposes of steel, ceramic, polymer, cement, carbon, and composite fabrics throughout a extensive diversity of industries. the themes addressed comprise digital packaging, shrewdpermanent fabrics, thermal administration, nondestructive review, and fabrics improvement. The textual content is obvious, coherent, and educational widespread, comprises quite a few updated references, and offers historical past fabric in a chain of appendices.
Unique in its breadth of insurance of either fabrics and their purposes, utilized fabrics technological know-how is either scientifically wealthy and technologically correct. if you happen to paintings or educate those who aspire to paintings in an engineering potential, you can find no textual content or reference that greater prepares its readers for real-world purposes of engineering fabrics.
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Extra info for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
With the rapid growth of the electronics industry, they are finding more and more electronic applications. Due to the vast difference in property requirements between structural and electronic composites, the design criteria are different. While structural composites emphasize high strength and high modulus, electronic composites emphasize high thermal conductivity, low thermal expansion, low dielectric constant, high/low ©2001 CRC Press LLC electrical conductivity, and/or electromagnetic interference (EMI) shielding effectiveness, depending on the particular electronic application.
236-239 (1995). Y. Xu, X. L. Chung, J. Electron. Packaging, 122(2), 128-131 (2000). Y. Xu, X. L. Chung, J. Electron. Packaging, in press. 4 Summary References SYNOPSIS Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibers, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity, and electromagnetic interference shielding.
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Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries by Deborah D. L. Chung